Sputtering coating technology

1, Nā hiʻohiʻona o ka uhi ʻana i ka sputter
Ke hoʻohālikelike ʻia me ka uhi ʻana o ka vacuum evaporation maʻamau, loaʻa ka sputtering coating i nā hiʻohiʻona aʻe:
(1) Hiki ke hoʻoheheʻe ʻia kekahi mea, ʻoi aku ka nui o ka hoʻoheheʻe ʻana, nā mea haʻahaʻa haʻahaʻa kaomi mahu a me nā pūhui.I ka lōʻihi o ka paʻa, inā he metala, semiconductor, insulator, pūhui a me ka hui ʻana, a me nā mea ʻē aʻe, inā he poloka, hiki ke hoʻohana ʻia nā mea granular ma ke ʻano he mea pahuhopu.Ma muli o ka liʻiliʻi o ka decomposition a me ka haʻihaʻi ʻana i ka wā e sputtering i nā mea insulating a me nā alloys e like me nā oxides, hiki ke hoʻohana ʻia e hoʻomākaukau i nā kiʻiʻoniʻoni lahilahi a me nā kiʻi ʻoniʻoni me nā ʻāpana like ʻole e like me nā mea i loaʻa, a me nā kiʻi superconducting me nā haku paʻakikī.' Eia kekahi, Hiki ke hoʻohana ʻia ke ʻano reactive sputtering e hana i nā kiʻiʻoniʻoni o nā pūhui ʻokoʻa loa mai ka mea i manaʻo ʻia, e like me nā oxides, nitrides, carbide a me silicides.
(2) Hoʻopili maikaʻi ma waena o ke kiʻi sputtered a me ka substrate.No ka mea, he 1-2 ka nui o ka ikehu o na atoms sputtered ma mua o ka nui o ka atoms evaporated, ʻo ka hoʻololi ʻana o ka ikehu o nā ʻāpana ikehu kiʻekiʻe i waiho ʻia ma ka substrate e hoʻohua i ka ikehu wela kiʻekiʻe, kahi e hoʻonui ai i ka hoʻopili ʻana o nā atoms sputtered i ka substrate.E hoʻokomo ʻia kahi ʻāpana o nā ʻātoma sputtered ikaika i nā ʻano like ʻole, e hana ana i kahi papa pseudo-diffusion i kapa ʻia ma ka substrate kahi e "miscible" ai nā ʻātoma sputtered a me nā atom o ka substrate me kekahi.Eia kekahi, i ka wā o ka pana ʻana o nā ʻāpana sputtering, hoʻomaʻemaʻe mau ʻia ka substrate a hoʻāla ʻia i loko o ka wahi plasma, kahi e hoʻoneʻe ai i nā atoms precipitated maikaʻi ʻole, hoʻomaʻemaʻe a hoʻōla i ka ʻili substrate.ʻO ka hopena, ua hoʻonui nui ʻia ka hoʻopili ʻana o ka papa kiʻi sputtered i ka substrate.
(3) Kiʻekiʻe kiʻekiʻe o ka sputter coating, liʻiliʻi pinholes, a me ka maʻemaʻe kiʻekiʻe o ka papa kiʻiʻoniʻoni no ka mea ʻaʻohe crucible contamination, ʻaʻole hiki ke pale ʻia i ka waiho ʻana o ka mahu i ka wā o ke kaʻina hana sputter coating.
(4) maikaʻi controllability a me ka repeatability o kiʻi mānoanoa.No ka mea hiki ke hoʻokaʻawale ʻia ka hoʻokuʻu ʻana i kēia manawa a me ka manawa i hoʻopaʻa ʻia i ka wā o ka sputter coating, hiki ke hoʻomalu ʻia ka mānoanoa o ke kiʻiʻoniʻoni ma o ka hoʻomalu ʻana i ka manawa i manaʻo ʻia, no laila, maikaʻi ka mana o ka mānoanoa kiʻiʻoniʻoni a me ka reproducibility o ka mānoanoa o ke kiʻiʻoniʻoni e ka nui o ka sputtering o ka sputter coating. , a hiki ke uhi pono ʻia ke kiʻiʻoniʻoni o ka mānoanoa i koho mua ʻia.Eia kekahi, hiki ke loaʻa i ka uhi sputter kahi mānoanoa kiʻiʻoniʻoni like ʻole ma kahi ākea.Eia nō naʻe, no ka ʻenehana hoʻoheheʻe sputter maʻamau (ʻoi aku ka nui o ka sputtering dipole), paʻakikī nā mea hana a koi ʻia ka mīkini kiʻekiʻe;ʻO ka wikiwiki o ka hoʻokumu ʻana o ke kiʻiʻoniʻoni he haʻahaʻa, ʻo 0.1 ~ 5nm / min ka nui o ka hoʻoheheʻe ʻana, ʻoiai ʻo 0.01 ~ 0.5nm / min ka nui o ka sputtering;he kiʻekiʻe ka piʻi ʻana o ka wela o ka substrate a hiki ke hoʻopili ʻia i ke kinoea haumia, a me nā mea ʻē aʻe. Eia naʻe, ma muli o ka hoʻomohala ʻana o ka RF sputtering a me ka magnetron sputtering ʻenehana, ua loaʻa ka holomua nui i ka loaʻa ʻana o ka hoʻopaʻa ʻana i ka sputtering wikiwiki a hoʻemi i ka mahana substrate.Eia kekahi, i kēia mau makahiki i hala iho nei, ke noiʻi ʻia nei nā ʻano hana hou o ka sputter coating - e pili ana i ka planar magnetron sputtering - e hōʻemi i ke kaomi ea sputtering a hiki i ka zero-pressure sputtering kahi e lilo ai ke kaomi o ke kinoea intake i ka wā sputtering.