Vacuum magnetron sputtering is particularly suitable for reactive deposition coatings. In fact, this process can deposit thin films of any oxide, carbide, and nitride materials. In addition, the process is also particularly suitable for the deposition of multilayer film structures, including optical designs, color films, wear-resistant coatings, nano-laminates, superlattice coatings, insulating films, etc. As early as 1970, high quality optical film deposition examples have been developed for a variety of optical film layer materials. These materials include transparent conductive materials, semiconductors, polymers, oxides, carbides, and nitrides, while fluorides are used in processes such as evaporative coating.
The main advantage of the magnetron sputtering process is using reactive or non-reactive coating processes to deposit layers of these materials and well control of the layer composition, film thickness, film thickness uniformity and mechanical properties of the layer. The process has the characteristics as follows.
1、Large deposition rate. Due to the use of high-speed magnetron electrodes, a large ion flow can be obtained, effectively improving the deposition rate and sputtering rate of this coating process. Compared with other sputtering coating processes, magnetron sputtering has a high capacity and high yield, and is widely used in various industrial production.
2、High power efficiency. Magnetron sputtering target generally choose the voltage within the range of 200V-1000V, usually is 600V, because the voltage of 600V is just within the highest effective range of power efficiency.
3. Low sputtering energy. The magnetron target voltage is applied low, and the magnetic field confines the plasma near the cathode, which prevents higher energy charged particles from launching onto the substrate.
4、Low substrate temperature. The anode can be used to guide away the electrons generated during the discharge, no need the substrate support to complete, which can effectively reduce the electron bombardment of the substrate. Thus the substrate temperature is low, which is very ideal for some plastic substrates that are not very resistant to high temperature coating.
5, Magnetron sputtering target surface etching is not uniform. Magnetron sputtering target surface etching uneven is caused by the uneven magnetic field of the target. The location of the target etching rate is larger, so that the effective utilization rate of the target is low (only 20-30% utilization rate). Therefore, to improve the target utilization, the magnetic field distribution needs to be changed by certain means, or the use of magnets moving in the cathode can also improve the target utilization.
6、Composite target. Can make composite target coating alloy film. At present, the use of composite magnetron target sputtering process has been successfully coated on Ta-Ti alloy, (Tb-Dy)-Fe and Gb-Co alloy film. Composite target structure has four kinds, respectively, are the round inlaid target, square inlaid target, small square inlaid target and sector inlaid target. The use of the sector inlaid target structure is better.
7. Wide range of applications. Magnetron sputtering process can deposit many elements, the common ones are: Ag, Au, C, Co, Cu, Fe, Ge, Mo, Nb, Ni, Os, Cr, Pd, Pt, Re, Rh, Si, Ta, Ti, Zr, SiO, AlO, GaAs, U, W, SnO, etc.
Magnetron sputtering is one of the most widely used coating processes to obtain high quality films. With a new cathode, it has high target utilization and high deposition rate. Guangdong Zhenhua Technology vacuum magnetron sputtering coating process is now widely used in the coating of large-area substrates. The process is not only used for single-layer film deposition, but also for multi-layer film coating, in addition, it is also used in the roll to roll process for packaging film, optical film, lamination and other film coating
Post time: May-31-2024