No.1 TGV Glass Through Hole Coating Technology Overview
TGV Glass Through Hole Coating is an emerging microelectronic packaging technology that involves creating through-holes in glass substrates and metallizing their inner walls to achieve high-density electrical interconnections. Compared to traditional TSV (Through Silicon Via) and organic substrates, TGV glass offers advantages such as low signal loss, high transparency, and excellent thermal stability. These properties make TGV suitable for applications in 5G communication, optoelectronic packaging, MEMS sensors, and more.
No.2 Market Prospects: Why is TGV Glass Gaining Attention?
With the rapid development of high-frequency communication, optoelectronic integration, and advanced packaging technologies, the demand for TGV glass is steadily increasing:
5G and Millimeter-Wave Communication: The low-loss characteristics of TGV glass make it ideal for high-frequency RF devices such as antennas and filters.
Optoelectronic Packaging: The high transparency of glass is advantageous for applications like silicon photonics and LiDAR.
MEMS Sensor Packaging: TGV glass enables high-density interconnections, enhancing the miniaturization and performance of sensors.
Advanced Semiconductor Packaging: With the rise of Chiplet technology, TGV glass substrates hold significant potential in high-density packaging.
No.3 TGV Glass PVD Coating Detailed Process
The metallization of TGV Glass PVD Coating involves depositing conductive materials on the inner walls of the vias to achieve electrical interconnections. The typical process flow includes:
1. TGV Glass Through Hole Formation: Laser drilling (UV/CO₂ lasers), wet etching, or dry etching is used to create TGV vias, followed by cleaning.
2. Surface Treatment: Plasma or chemical treatment is applied to enhance the adhesion between the glass and the metallization layer.
3. Seed Layer Deposition: PVD (Physical Vapor Deposition) or CVD (Chemical Vapor Deposition) is used to deposit a metal seed layer (e.g., copper, titanium/copper, palladium) on the glass through hole walls.
4. Electroplating: Conductive copper is deposited on the seed layer through electroplating to achieve low-resistance interconnections.
5. After treatment: Excess metal is removed, and surface passivation is performed to improve reliability.
No.4 Process Challenges: Challenges of TGV Glass Deep Hole Coating Machine
Despite its promising prospects, TGV Glass Deep Hole Coating Machine faces several technical challenges:
1.Uniformity of TGV Glass Deep Hole Coating : Glass Deep Hole with high aspect ratios (5:1 to 10:1) often suffer from metal accumulation at the via entrance and insufficient filling at the bottom.
2. Seed Layer Deposition: Glass is an insulator, making it challenging to deposit a high-quality conductive seed layer on the via walls.
3. Stress Control: Differences in the thermal expansion coefficients of metal and glass can lead to warping or cracking.
4. Adhesion of Glass Deep Hole coating Layers: The smooth surface of glass results in weak metal adhesion, necessitating optimized surface treatment processes.
5. Mass Production and Cost Control: Improving metallization efficiency and reducing costs are critical for the commercialization of TGV technology.
No.5 Zhenhua Vacuum’s TGV Glass PVD Coating Equipment Solution – Horizontal Coating In-line Coater
Equipment Advantages:
1. Exclusive Glass Through-Hole Metallization Coating technology
Zhenhua Vacuum’s proprietary Glass Through-Hole Metallization Coating technology can handle Glass Through-Hole with aspect ratios of up to 10:1, even for tiny apertures as small as 30 microns.
2. Customizable for Different Sizes
Supports glass substrates of various sizes, including 600×600mm, 510×515mm, or larger.
3. Process Flexibility
Compatible with conductive or functional thin-film materials such as Cu, Ti, W, Ni, and Pt, meeting diverse application requirements for conductivity and corrosion resistance.
4. Stable Performance and Easy Maintenance
Equipped with an intelligent control system for automatic parameter adjustment and real-time monitoring of film thickness uniformity. Modular design ensures easy maintenance and reduced downtime.
Application Scope: Suitable for TGV/TSV/TMV advanced packaging, it can achieve through-hole seed layer coating with hole depth ratio ≥ 10:1.
–This article is released by TGV Glass Through Hole Coating Machine Manufacturer Zhenhua Vacuum
Post time: Mar-07-2025