The performance of various vacuum pumps has other differences besides the ability to pump vacuum to the chamber. Therefore, it is very important to clarify the work undertaken by the pump in the vacuum system when choosing, and the role played by the pump in different working fields is summarized as follows.
1、Being the main pump in the system
The main pump is the vacuum pump that directly pumps the pumped chamber of the vacuum system to get the vacuum degree required to meet the process requirements.
2、Rough pumping pump
Rough pumping pump is the vacuum pump that starts to reduce from air pressure and the pressure of vacuum system reaches another pumping system which can start to work.
3、Pre-stage pump
Pre-stage pump is a vacuum pump used to maintain the pre-stage pressure of another pump below its highest permitted pre-stage pressure.
4、Holding pump
Holding pump is a pump that can’t effectively use the main pre-stage pump when the vacuum system pumping is very small. For this reason, another kind of auxiliary pre-stage pump with smaller pumping speed is used in the vacuum system to maintain the normal work of the main pump or to maintain the low pressure required by the emptied container.
5、Rough vacuum pump or low vacuum pump
Rough or low vacuum pump is a vacuum pump that starts from the air and works in the range of low or rough vacuum pressure after reducing the pressure of the pumped container.
6、High vacuum pump
High vacuum pump refers to the vacuum pump working in high vacuum range.
7、Ultra-high vacuum pump
Ultra-high vacuum pump refers to the vacuum pump working in ultra-high vacuum range.
8、Booster pump
Booster pump usually refers to the vacuum pump working between low vacuum pump and high vacuum pump to increase the pumping capacity of pumping system in the middle pressure range or reduce the pumping rate requirement of the former pump.
Introduction to Ion Cleaner
Plasma Cleaner
1. Plasma is an ionized gas in which the densities of positive ions and electrons are approximately equal. It consists of ions, electrons, free radicals, and neutral particles.
2. It is the fourth state of matter. As plasma is a combination of higher energy than gas, the substance in the plasma environment can obtain more physicochemical and other reaction characteristics.
3. plasma cleaning machine mechanism is to rely on the “plasma state” of the material “activation effect” to remove surface stains.
4. Plasma cleaning is also the most bottomless stripping type of cleaning among all cleaning methods. It can be widely used in semiconductor, microelectronics, COG, LCD, LCM and LED process.
5. Precision cleaning before device packaging, vacuum electronics, connectors and relays, solar photovoltaic industry, plastic, rubber, metal and ceramic surface cleaning, etching treatment, ashing treatment, surface activation and other fields of life science experiments.
Post time: Nov-07-2022