Equipment advantage
1. Deep Hole Coating Optimization
Exclusive Deep Hole Coating Technology: Zhenhua Vacuum’s self-developed deep hole coating technology can achieve a superior aspect ratio of 10:1 even for tiny apertures as small as 30 micrometers, overcoming the coating challenges of complex deep hole structures.
2. Customizable, Supports Different Sizes
Supports glass substrates of various sizes, including 600×600mm / 510×515mm or larger specifications.
3. Process Flexibility, Compatible with Multiple Materials
The equipment is compatible with conductive or functional thin film materials such as Cu, Ti, W, Ni, and Pt, meeting different application needs for conductivity and corrosion resistance.
4. Stable Equipment Performance, Easy Maintenance
The equipment is equipped with an intelligent control system that enables automatic parameter adjustment and real-time monitoring of film thickness uniformity; it adopts a modular design for easy maintenance, reducing downtime.
Application: Can be used for TGV/TSV/TMV advanced packaging, capable of achieving deep hole seed layer coating with an aspect ratio ≥10:1.