Iimpawu zobugcisa ze-vacuum magnetron sputtering coating equipment

I-vacuum magnetron sputtering ifanelekile ngokukodwa kwi-reactive deposition coatings.Ngapha koko, le nkqubo inokufaka iifilimu ezibhityileyo zayo nayiphi na i-oxide, i-carbide, kunye nemathiriyeli ye-nitride.Ukongeza, le nkqubo ikwafaneleka ngokukodwa ukubekwa kwezakhiwo zefilimu ezininzi, kubandakanywa uyilo lwe-optical, iifilimu zemibala, ii-coatings ezingagugiyo, i-nano-laminates, i-superlattice coatings, iifilimu ezikhuselayo, njl. imizekelo yokubeka iphuhliselwe iindidi zemathiriyeli yomaleko wefilimu.Ezi zixhobo ziquka izinto zokuqhuba ezicacileyo, i-semiconductors, iipolymers, i-oxides, i-carbides, kunye ne-nitrides, ngelixa i-fluorides isetyenziswa kwiinkqubo ezifana nokugquma kwe-evaporative.

Inzuzo ephambili yenkqubo ye-magnetron sputtering kukusebenzisa iinkqubo zokugquma okanye ezingasebenziyo zokufakela iileya zediphozithi zezi zinto kunye nokulawula kakuhle ukubunjwa kobume, ubukhulu befilimu, ukufana kwefilimu kunye neempawu zomatshini zomaleko.Inkqubo ineempawu ngolu hlobo lulandelayo.

1. Ixabiso elikhulu lokubekwa.Ngenxa yokusetyenziswa kwee-electrode ze-magnetron ezinesantya esiphezulu, ukuhamba kwe-ion enkulu kunokufumaneka, ukuphucula ngokufanelekileyo izinga lokubekwa kunye nesantya sokutshiza le nkqubo yokugquma.Xa kuthelekiswa nezinye iinkqubo zokugquma i-sputtering, i-magnetron sputtering inomthamo ophezulu kunye nesivuno esikhulu, kwaye isetyenziswa ngokubanzi kwimveliso eyahlukeneyo yemizi-mveliso.

2. Ukusebenza kwamandla aphezulu.I-Magnetron sputtering target idla ngokukhetha amandla ombane phakathi koluhlu lwe-200V-1000V, idla ngokuba yi-600V, kuba amandla ombane angama-600V angaphakathi kolona luhlu lusebenzayo lwamandla ombane.

3. Amandla okutshiza aphantsi.I-voltage ye-magnetron ekujoliswe kuyo isetyenziswe ephantsi, kwaye intsimi yamagnetic ivalela iplasma kufuphi ne-cathode, ethintela amasuntswana aphezulu ahlawuliswa amandla ukuba aqalise kwi-substrate.

4, Ubushushu be-substrate ephantsi.I-anode ingasetyenziselwa ukukhokela ii-electron ezenziwe ngexesha lokukhutshwa, akukho mfuneko yokuxhaswa kwe-substrate ukugqiba, enokunciphisa ngokufanelekileyo i-electron bombardment ye-substrate.Ngaloo ndlela iqondo lobushushu le-substrate liphantsi, elilungele kakhulu ezinye ii-substrates zeplastiki ezingaxhathisi kakhulu kwi-coating yobushushu obuphezulu.

I-5, i-Magnetron sputtering target surface etching ayifani.I-Magnetron sputtering target surface etching ukungalingani kubangelwa yimagnethi engalinganiyo yethagethi.Indawo ekujoliswe kuyo ireyithi ye-etching inkulu, ukwenzela ukuba izinga lokusetyenziswa okusebenzayo kwethagethi liphantsi (kuphela i-20-30% yezinga lokusetyenziswa).Ke ngoko, ukuphucula ukusetyenziswa okujoliswe kuko, ukuhanjiswa kwemagnethi kufuneke kutshintshwe ngeendlela ezithile, okanye ukusetyenziswa kweemagnethi ezihamba kwi-cathode kunokuphucula ukusetyenziswa kwethagethi.

6, Ithagethi ehlanganisiweyo.Unokwenza ifilimu ehlanganisiweyo yokwaleka ekujoliswe kuyo.Okwangoku, ukusetyenziswa kwenkqubo ye-sputtering ye-magnetron edibeneyo edibeneyo ifakwe ngempumelelo kwi-alloy ye-Ta-Ti, (Tb-Dy) -Fe kunye nefilimu ye-Gb-Co ye-alloy.Ulwakhiwo oludityanisiweyo lwethagethi luziindidi ezine, ngokulandelelanayo, lungqukuva oluqingqiwe ekujoliswe kuko, isikwere esiqingqweyo ekujoliswe kuso, isikwere esincinci ekujoliswe kuso kunye nethagethi eyakhiweyo yecandelo.Ukusetyenziswa kolwakhiwo ekujoliswe kulo kwicandelo lungcono.

7. Uluhlu olubanzi lwezicelo.Inkqubo ye-Magnetron sputtering inokufaka izinto ezininzi, eziqhelekileyo zezi: Ag, Au, C, Co, Cu, Fe, Ge, Mo, Nb, Ni, Os, Cr, Pd, Pt, Re, Rh, Si, Ta, Ti. , Zr, SiO, AlO, GaAs, U, W, SnO, njl.

I-Magnetron sputtering yenye yezona nkqubo zisetyenziswa kakhulu zokugquma ukufumana iifilimu ezikumgangatho ophezulu.Nge-cathode entsha, inokusetyenziswa okujoliswe kuko okuphezulu kunye nesantya esiphezulu sokubeka.Guangdong Zhenhua Technology vacuum magnetron sputtering inkqubo yokugquma ngoku isetyenziswa ngokubanzi ekwalekeni iindawo ezinkulu substrates.Inkqubo ayisetyenziswanga kuphela ukubekwa kwefilimu yomaleko omnye, kodwa kunye nokufakwa kwefilimu enemigangatho emininzi, ukongezelela, iphinda isetyenziswe kumqulu wokuqengqeleka inkqubo yokupakisha ifilimu, ifilimu yamehlo, i-lamination kunye nezinye iifilimu.