1. Izici ze-sputter coating
Uma kuqhathaniswa ne-vacuum evaporation evamile, ukunamathela kwe-sputtering kunezici ezilandelayo:
(1) Noma iyiphi into ingafafazwa, ikakhulukazi indawo yokuncibilika ephezulu, izakhi zokucindezela komhwamuko ophansi nezinhlanganisela.Uma nje iqinile, kungakhathaliseki ukuthi insimbi, i-semiconductor, insulator, i-compound kanye nengxube, njll., kungakhathaliseki ukuthi i-block, i-granular material ingasetshenziswa njengento ehlosiwe.Njengoba ukubola nokuhlukaniswa okuncane kwenzeka lapho kufafazwa izinto ezivikelayo kanye nama-alloys njengama-oxides, angasetshenziswa ukulungisa amafilimu amancane namafilimu engxubevange anezakhi ezifanayo ezifana nalezo ezihlosiwe, ngisho namafilimu e-superconducting anezingoma eziyinkimbinkimbi.´ Ngaphezu kwalokho, indlela ye-sputtering esebenzayo ingase futhi isetshenziselwe ukukhiqiza amafilimu ezinhlanganisela ezihluke ngokuphelele ezintweni ezihlosiwe, njengama-oxides, ama-nitrides, ama-carbides nama-silicides.
(2) Ukunamathela okuhle phakathi kwefilimu efafaziwe ne-substrate.Njengoba amandla ama-athomu ahlakazekile engama-oda angu-1-2 obukhulu aphakeme kunalawo ama-athomu ahwamukile, ukuguqulwa kwamandla ezinhlayiya ezinamandla ezifakwe ku-substrate kukhiqiza amandla aphezulu okushisa, okuthuthukisa ukunamathela kwama-athomu ahlakazekile ku-substrate.Ingxenye yama-athomu ahlakazekile anamandla aphezulu izojovwa ngamazinga ahlukahlukene, yenze ungqimba olubizwa ngokuthi i-pseudo-diffusion layer phezu kwe-substrate lapho ama-athomu ahlakazekile kanye nama-athomu e-substrate material "miscible" nomunye nomunye.Ngaphezu kwalokho, ngesikhathi sokuqhunyiswa kwamabhomu kwezinhlayiya ezifafazayo, i-substrate ihlale ihlanzwa futhi isebenze endaweni ye-plasma, esusa ama-athomu anamandla angabambeki kahle, ihlanze futhi isebenze indawo engaphansi.Ngenxa yalokho, ukunamathela kwesendlalelo sefilimu e-sputtered ku-substrate kuthuthukiswa kakhulu.
(3) Ukuminyana okuphezulu kokunamathela kwe-sputter, izimbobo ezincane, kanye nokuhlanzeka okuphezulu kwesendlalelo sefilimu ngenxa yokuthi akukho ukungcoliswa okunamandla, okungagwemeki ekufakweni komhwamuko wevacuum phakathi nenqubo yokumboza i-sputter.
(4) Ukulawuleka okuhle nokuphindaphindwa kokuqina kwefilimu.Njengoba ukukhishwa kwamanje kanye namanje okuhlosiwe kungalawulwa ngokuhlukana ngesikhathi sokumbozwa kwe-sputter, ubukhulu befilimu bungalawulwa ngokulawula ukuqina kwefilimu kanye nokuphindaphindeka kogqinsi lwefilimu ngokufafaza okuningi kwe-sputter coating kuhle. , futhi ifilimu yokuqina okunqunywe kusengaphambili ingahlanganiswa ngokuphumelelayo.Ngaphezu kwalokho, i-sputter coating ingathola ukushuba kwefilimu efanayo endaweni enkulu.Kodwa-ke, kubuchwepheshe bokugqoka obujwayelekile be-sputter (ikakhulukazi i-dipole sputtering), okokusebenza kuyinkimbinkimbi futhi kudinga idivayisi yokucindezela okuphezulu;isivinini sokwakheka kwefilimu sokufakwa kwe-sputter siphansi, izinga lokubeka ukuhwamuka kwe-vacuum ngu-0.1~5nm/min, kuyilapho izinga lokufafaza lingu-0.01~0.5nm/min;izinga lokushisa elingaphansi komhlaba liphezulu futhi lisengozini yegesi yokungcola, njll. Nokho, ngenxa yokuthuthukiswa kobuchwepheshe be-RF sputtering kanye ne-magnetron sputtering, kuye kwatholakala inqubekelaphambili enkulu ekufezeni ukufafaza okusheshayo kanye nokunciphisa izinga lokushisa le-substrate.Ngaphezu kwalokho, eminyakeni yamuva nje, izindlela ezintsha zokumboza i-sputter ziyaphenywa - ngokusekelwe ku-planar magnetron sputtering - ukunciphisa ukucindezela komoya okuphefumulayo kuze kube yilapho i-zero-pressure sputtering lapho ingcindezi yegesi ethathayo ngesikhathi sokufafaza izoba ngu-zero.
Isikhathi sokuthumela: Nov-08-2022